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Ku CA, Hung CW, Chung CK.Ku CA, et al. Among authors: chung ck.Nanomaterials (Basel). 2024 Jul 17;14(14):1216. doi: 10.3390/nano14141216.Nanomaterials (Basel). 2024.PMID: 39057892Free PMC article.
Ku CA, Chung CK.Ku CA, et al. Among authors: chung ck.Sensors (Basel). 2023 Feb 20;23(4):2328. doi: 10.3390/s23042328.Sensors (Basel). 2023.PMID: 36850926Free PMC article.Review.
Lin DY, Yu CY, Ku CA, Chung CK.Lin DY, et al. Among authors: chung ck.Micromachines (Basel). 2023 Jun 30;14(7):1343. doi: 10.3390/mi14071343.Micromachines (Basel). 2023.PMID: 37512654Free PMC article.Review.
Ku CA, Yu CY, Hung CW, Chung CK.Ku CA, et al. Among authors: chung ck.Nanomaterials (Basel). 2023 Oct 27;13(21):2853. doi: 10.3390/nano13212853.Nanomaterials (Basel). 2023.PMID: 37947698Free PMC article.Review.
Ku CA, Wu CC, Hung CW, Chung CK.Ku CA, et al. Among authors: chung ck.Micromachines (Basel). 2024 May 23;15(6):683. doi: 10.3390/mi15060683.Micromachines (Basel). 2024.PMID: 38930653Free PMC article.
Chung CK, Liao MW, Lee CT, Chang HC.Chung CK, et al.Nanoscale Res Lett. 2011 Nov 16;6(1):596. doi: 10.1186/1556-276X-6-596.Nanoscale Res Lett. 2011.PMID: 22087646Free PMC article.