Silicon Oxide Etching Process of NF3 and F3NO Plasmas with a Residual Gas Analyzer.
Kim WJ, Bang IY, Kim JH, Park YS, Kwon HT, Shin GW, Kang MH, Cho Y, Kwon BH, Kwak JH, Kwon GC.
Kim WJ, et al. Among authors: kwon bh, kwon ht, kwon gc.
Materials (Basel). 2021 Jun 2;14(11):3026. doi: 10.3390/ma14113026.
Materials (Basel). 2021.
PMID: 34199585
Free PMC article.