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Fan PY, Chun KP, Tan ML, Mah DN, Mijic A, Strickert G, Yetemen O.Fan PY, et al. Among authors: tan ml.PLoS One. 2023 Sep 8;18(9):e0289780. doi: 10.1371/journal.pone.0289780. eCollection 2023.PLoS One. 2023.PMID: 37682889Free PMC article.
Fan PY, Chun KP, Mijic A, Tan ML, Yetemen O.Fan PY, et al. Among authors: tan ml.J Environ Manage. 2022 Aug 15;316:115232. doi: 10.1016/j.jenvman.2022.115232. Epub 2022 May 13.J Environ Manage. 2022.PMID: 35569354Free article.
He X, Zhang F, Cai Y, Tan ML, Chan NW.He X, et al. Among authors: tan ml.Environ Sci Pollut Res Int. 2023 Jun;30(30):75511-75531. doi: 10.1007/s11356-023-27702-x. Epub 2023 May 24.Environ Sci Pollut Res Int. 2023.PMID: 37222898
Song J, He X, Zhang F, Wang W, Chan NW, Shi J, Tan ML.Song J, et al. Among authors: tan ml.PLoS One. 2024 Oct 25;19(10):e0312388. doi: 10.1371/journal.pone.0312388. eCollection 2024.PLoS One. 2024.PMID: 39453961Free PMC article.
Zhou J, Johnson VC, Shi J, Tan ML, Zhang F.Zhou J, et al. Among authors: tan ml.PLoS One. 2025 Jan 24;20(1):e0316255. doi: 10.1371/journal.pone.0316255. eCollection 2025.PLoS One. 2025.PMID: 39854555Free PMC article.
Yang S, Tan ML, Song Q, He J, Yao N, Li X, Yang X.Yang S, et al. Among authors: tan ml.J Environ Manage. 2023 Mar 15;330:117244. doi: 10.1016/j.jenvman.2023.117244. Epub 2023 Jan 6.J Environ Manage. 2023.PMID: 36621311
Chen D, Zhang F, Zhang M, Meng Q, Jim CY, Shi J, Tan ML, Ma X.Chen D, et al. Among authors: tan ml.Sci Total Environ. 2022 Jun 15;825:154006. doi: 10.1016/j.scitotenv.2022.154006. Epub 2022 Feb 19.Sci Total Environ. 2022.PMID: 35192831
Xu H, Zhang F, Li W, Shi J, Johnson BA, Tan ML.Xu H, et al. Among authors: tan ml.Environ Monit Assess. 2023 Dec 27;196(1):94. doi: 10.1007/s10661-023-12249-8.Environ Monit Assess. 2023.PMID: 38150164
Li Z, Zhang F, Shi J, Chan NW, Tan ML, Kung HT, Liu C, Cheng C, Cai Y, Wang W, Li X.Li Z, et al. Among authors: tan ml.Mar Pollut Bull. 2023 Nov;196:115653. doi: 10.1016/j.marpolbul.2023.115653. Epub 2023 Oct 24.Mar Pollut Bull. 2023.PMID: 37879130Review.