A solvent-free processed low-temperature tolerant adhesive.
Xie X, Jiang Y, Yao X, Zhang J, Zhang Z, Huang T, Li R, Chen Y, Li SL, Lan YQ.
Xie X, et al. Among authors: yao x.
Nat Commun. 2024 Jun 12;15(1):5017. doi: 10.1038/s41467-024-49503-7.
Nat Commun. 2024.
PMID: 38866776
Free PMC article.