Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper.
Wen LG, Roussel P, Pedreira OV, Briggs B, Groven B, Dutta S, Popovici MI, Heylen N, Ciofi I, Vanstreels K, Østerberg FW, Hansen O, Petersen DH, Opsomer K, Detavernie C, Wilson CJ, Elshocht SV, Croes K, Bömmels J, Tőkei Z, Adelmann C.
Wen LG, et al. Among authors: osterberg fw.
ACS Appl Mater Interfaces. 2016 Oct 5;8(39):26119-26125. doi: 10.1021/acsami.6b07181. Epub 2016 Sep 21.
ACS Appl Mater Interfaces. 2016.
PMID: 27598509