An official website of the United States government
The .gov means it’s official.
Federal government websites often end in .gov or .mil. Before
sharing sensitive information, make sure you’re on a federal
government site.
The site is secure.
The https:// ensures that you are connecting to the
official website and that any information you provide is encrypted
and transmitted securely.
Ge JJ, Zhang D, Li Q, Hou H, Graham MJ, Dai L, Harris FW, Cheng SZ.Ge JJ, et al. Among authors: dai l.J Am Chem Soc. 2005 Jul 20;127(28):9984-5. doi: 10.1021/ja050924s.J Am Chem Soc. 2005.PMID: 16011346
Bajpai V, Dai L, Ohashi T.Bajpai V, et al. Among authors: dai l.J Am Chem Soc. 2004 Apr 28;126(16):5070-1. doi: 10.1021/ja031738u.J Am Chem Soc. 2004.PMID: 15099081
Li S, He P, Dong J, Guo Z, Dai L.Li S, et al. Among authors: dai l.J Am Chem Soc. 2005 Jan 12;127(1):14-5. doi: 10.1021/ja0446045.J Am Chem Soc. 2005.PMID: 15631425
Lee KM, Li L, Dai L.Lee KM, et al. Among authors: dai l.J Am Chem Soc. 2005 Mar 30;127(12):4122-3. doi: 10.1021/ja0423670.J Am Chem Soc. 2005.PMID: 15783165
Wei C, Dai L, Roy A, Tolle TB.Wei C, et al. Among authors: dai l.J Am Chem Soc. 2006 Feb 8;128(5):1412-3. doi: 10.1021/ja0570335.J Am Chem Soc. 2006.PMID: 16448087
Qu L, Dai L, Osawa E.Qu L, et al. Among authors: dai l.J Am Chem Soc. 2006 Apr 26;128(16):5523-32. doi: 10.1021/ja060296u.J Am Chem Soc. 2006.PMID: 16620126
In conjunction with the substrate-enhanced electroless deposition (SEED) technique (Qu, L.; Dai, L. J. Am. Chem. Soc. 2005, 127, 10806), the shape/size-controlled syntheses have been successfully exploited to site-selectively deposit these metal nanoparticles …
In conjunction with the substrate-enhanced electroless deposition (SEED) technique (Qu, L.; Dai, L. J. Am. Chem. Soc. 2 …
Wang S, Yu D, Dai L.Wang S, et al. Among authors: dai l.J Am Chem Soc. 2011 Apr 13;133(14):5182-5. doi: 10.1021/ja1112904. Epub 2011 Mar 17.J Am Chem Soc. 2011.PMID: 21413707
Dai L, Patil A, Gong X, Guo Z, Liu L, Liu Y, Zhu D.Dai L, et al.Chemphyschem. 2003 Nov 14;4(11):1150-69. doi: 10.1002/cphc.200300770.Chemphyschem. 2003.PMID: 14652993
He P, Dai L.He P, et al. Among authors: dai l.Chem Commun (Camb). 2004 Feb 7;(3):348-9. doi: 10.1039/b313030b. Epub 2004 Jan 13.Chem Commun (Camb). 2004.PMID: 14740071