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Page 1
Nanostructured copper filaments in electrochemical deposition.
Wang M, Zhong S, Yin XB, Zhu JM, Peng RW, Wang Y, Zhang KQ, Ming NB. Wang M, et al. Among authors: ming nb. Phys Rev Lett. 2001 Apr 23;86(17):3827-30. doi: 10.1103/PhysRevLett.86.3827. Phys Rev Lett. 2001. PMID: 11329334
Formation of nanostructured copper filaments in electrochemical deposition.
Zhong S, Wang Y, Wang M, Zhang MZ, Yin XB, Peng RW, Ming NB. Zhong S, et al. Among authors: ming nb. Phys Rev E Stat Nonlin Soft Matter Phys. 2003 Jun;67(6 Pt 1):061601. doi: 10.1103/PhysRevE.67.061601. Epub 2003 Jun 16. Phys Rev E Stat Nonlin Soft Matter Phys. 2003. PMID: 16241233
Noise-reduced electroless deposition of arrays of copper filaments.
Weng YY, Si JW, Gao WT, Wu Z, Wang M, Peng RW, Ming NB. Weng YY, et al. Among authors: ming nb. Phys Rev E Stat Nonlin Soft Matter Phys. 2006 May;73(5 Pt 1):051601. doi: 10.1103/PhysRevE.73.051601. Epub 2006 May 1. Phys Rev E Stat Nonlin Soft Matter Phys. 2006. PMID: 16802940
Self-templating growth of copper nanopearl-chain arrays in electrodeposition.
Weng YY, Zhang B, Fu SJ, Wang M, Peng RW, Ma GB, Shu DJ, Ming NB. Weng YY, et al. Among authors: ming nb. Phys Rev E Stat Nonlin Soft Matter Phys. 2010 May;81(5 Pt 1):051607. doi: 10.1103/PhysRevE.81.051607. Epub 2010 May 25. Phys Rev E Stat Nonlin Soft Matter Phys. 2010. PMID: 20866239
Long-range ordering effect in electrodeposition of zinc and zinc oxide.
Liu T, Wang S, Shi ZL, Ma GB, Wang M, Peng RW, Hao XP, Ming NB. Liu T, et al. Among authors: ming nb. Phys Rev E Stat Nonlin Soft Matter Phys. 2007 May;75(5 Pt 1):051606. doi: 10.1103/PhysRevE.75.051606. Epub 2007 May 31. Phys Rev E Stat Nonlin Soft Matter Phys. 2007. PMID: 17677077
58 results