The solder burrs on the 304V wire surface can easily scratch the vascular tissue during interventional treatment, resulting in complications such as medial tears, bleeding, dissection, and rupture. Abrasive blasting is often used to remove solder burr and obtain a smooth surface for the interventional device. This study conducted an abrasive blasting experiment to explore the effects of process parameters (air pressure, lift-off height, abrasive volume, and abrasive type) on processing time, surface roughness, and mechanical properties to reveal the material removal mechanism. The results indicated that the resin abrasive can remove the SAC burr and keep the 304V integrity due to the proper hardness and Young's module. Impaction pits are the main material removal mode in abrasive blasting. The processing time decreases with the increase in air pressure. The surface roughness increases with the increase in abrasive volume. The primary and secondary factors affecting the surface roughness of the 304V wire after abrasive blasting are the abrasive type and air pressure, followed by the abrasive volume and lift-off height. Blasting leads to a decrease in yield strength, and Young's modulus and the hardness of the abrasive will affect the tensile strength. This study lays a foundation for understanding abrasive blasting and different cutting mechanisms.
Keywords: abrasive blasting; interventional devices; orthogonal experiment; surface roughness.