The Structure of Co-Occurring Bullying Experiences and Associations with Suicidal Behaviors in Korean Adolescents

PLoS One. 2015 Nov 30;10(11):e0143517. doi: 10.1371/journal.pone.0143517. eCollection 2015.

Abstract

Objective: This study had two main goals: to examine the structure of co-occurring peer bullying experiences among adolescents in South Korea from the perspective of victims and to determine the effects of bullying on suicidal behavior, including suicidal ideation and suicide attempts, among adolescents.

Method: This study used data gathered from 4,410 treatment-seeking adolescents at their initial visits to 31 local mental health centers in Gyeonggi Province, South Korea. The structure of peer bullying was examined using latent class analysis (LCA) to classify participants' relevant experiences. Then, a binomial logistic regression adjusted by propensity scores was conducted to identify relationships between experiences of being bullied and suicidal behaviors.

Results: The LCA of experiences with bullying revealed two distinct classes of bullying: physical and non-physical. Adolescents who experienced physical bullying were 3.05 times more likely to attempt suicide than those who were not bullied. Victims of (non-physical) cyber bullying were 2.94 times more likely to attempt suicide than were those who were not bullied.

Conclusions: Both physical and non-physical bullying were associated with suicide attempts, with similar effect sizes. Schools and mental health professionals should be more attentive than they currently are to non-physical bullying.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Adolescent
  • Bullying / statistics & numerical data*
  • Female
  • Humans
  • Male
  • Republic of Korea
  • Suicide / psychology*
  • Suicide / statistics & numerical data

Grants and funding

The Hallym University Research Fund (2013) www.hallym.ac.kr. Hallym University (HJH). The funders had no role in study design, data collection and analysis, decision to publish, or preparation of the manuscript.