Metallopolymer formation using the (1R,2R)-N,N'-bis(pyridylmethylene)cyclohexane-1,2-diamine (BPID) ligand class

Dalton Trans. 2013 Apr 14;42(14):4768-71. doi: 10.1039/c3dt50327e.

Abstract

The BPID ligand class is exploited as a scaffold for polymeric materials. Reaction of excess K or KH with the 2-pyridyl-BPID ligand results in the formation of a novel THF-bridged 1-D metallopolymer while the analogous reaction with the 4-pyridyl derivative results in a pyridyl-bridged 2-D metallopolymer.