Programmable direct-printing nanowire electronic components

Nano Lett. 2010 Mar 10;10(3):1016-21. doi: 10.1021/nl904190y.

Abstract

In order for recently developed advanced nanowire (NW) devices(1-5) to be produced on a large scale, high integration of the separately fabricated nanoscale devices into intentionally organized systems is indispensible. We suggest a unique fabrication route for semiconductor NW electronics. This route provides a high yield and a large degree of freedom positioning the device on the substrate. Hence, we can achieve not only a uniform performance of Si NW devices with high fabrication yields, suppressing device-to-device variation, but also programmable integration of the NWs. Here, keeping pace with recent progress of direct-writing circuitry,(6-8) we show the flexibility of our approach through the individual integrating, along with the three predesigned N-shaped sites. On each predesigned site, nine bottom gate p-type Si NW field-effect transistors classified according to their on-current level are programmably integrated.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Crystallization / methods*
  • Electronics / instrumentation*
  • Equipment Design
  • Equipment Failure Analysis
  • Macromolecular Substances / chemistry
  • Materials Testing
  • Molecular Conformation
  • Nanostructures / chemistry*
  • Nanostructures / ultrastructure
  • Nanotechnology / instrumentation*
  • Particle Size
  • Semiconductors*
  • Silicon / chemistry*
  • Surface Properties

Substances

  • Macromolecular Substances
  • Silicon