Abstract
We describe a novel soft-lithographic technique possessing broad utility for the fabrication of large area, nanoscale ( approximately 100 nm) multilayer resist structures on electronic material substrates. This additive patterning method transfers ultrathin poly(dimethylsiloxane) (PDMS) decals to an underlying SiO(2)-capped organic planarazation layer. The PDMS patterns serve as a latent image through which high-quality multilayer resist structures can be developed using reactive ion-beam etching.
Publication types
-
Research Support, Non-U.S. Gov't
-
Research Support, U.S. Gov't, Non-P.H.S.
MeSH terms
-
Crystallization / methods*
-
Dimethylpolysiloxanes / chemistry*
-
Electronics*
-
Membranes, Artificial
-
Miniaturization / methods
-
Nanostructures / chemistry*
-
Nanostructures / ultrastructure*
-
Nanotechnology / methods
-
Particle Size
-
Photography / methods*
-
Silicon Dioxide / chemistry*
-
Silicones / chemistry*
-
Surface Properties
Substances
-
Dimethylpolysiloxanes
-
Membranes, Artificial
-
Silicones
-
baysilon
-
Silicon Dioxide